At the ongoing Mobile World Congress 2017 (MWC) in Barcelona, MediaTek made an announcement about its top-of-the-line chipset called the Helio X30. While the MediaTek Helio X30 was announced last year in August, the Taiwanese chipmaker announced some additional details about the chipset including availability of the same in handsets.
The Helio X30 is built by TSMC on 10nm FinFET process, which is down from the 20nm process that was used for the Helio X20. This should bring with it significant power savings as the current Android flagships are still on the 14nm / 16nm process whereas the Apple iPhone is expected to come with a 10nm chipset next year.
As you may already know by now, it is a deca-core chipset. You get a 64-bit deca-core CPU featuring a 64-bit deca-core Tri-Cluster setup which is something new for both the company and its clients.
Assisting all those cores is CorePilot 4.0, which delivers 25 percent more power saving than the previous version.
The chipset also packs in a 14-bit ISP that supports two 16MP camera. There’s ClearZoom and Total Noise Reduction, new technologies that are said to deliver superior image quality.
There’s also a new Vision Processing Unit (VPU) that will be present to ease the load from the CPU and GPU.
You get support for UFS 2.1 storage, and the chip can handle up to 8GB of LPDDR4x RAM clocked at 1,866MHz.
“Just like your heart automatically reacts to numerous tasks your body is doing, CorePilot 4.0 automatically directs power where and when it’s needed to maintain efficiency. Consumers today demand extreme performance from their smartphones, on top of a long battery life. CorePilot 4.0 perfectly balances power and efficiency, and adapts to users’ computing patterns to manage power consumption,” Jeffrey Ju, executive vice president and Co-COO of MediaTek said in a statement.
The new chipset will ship in handsets starting from the second half of this year, which is around June and July.